
2 days ago
Vice Provost, Academic Affairs
Vice Provost Office
Location
Vietnam
Open Date
Feb 5, 2021
Description
ABOUT VINUNIVERSITY
VinUniversity (VinUni: https://vinuni.edu.vn/) is the first private, not-for-profit Vietnamese university established based on international standards. The university...

2 days ago
Vice Provost, Research & Innovation
Vice Provost Office
Location
Vietnam
Open Date
Feb 5, 2021
Description
ABOUT VINUNIVERSITY
VinUniversity (VinUni: https://vinuni.edu.vn/) is the first private, not-for-profit Vietnamese university established based on international standards. The university...

2 days ago
Dean of Engineering & Computer Science
College of Engineering and Computer Science
Location
Vietnam
Open Date
Feb 5, 2021
Description
ABOUT VINUNIVERSITY
VinUniversity (VinUni: https://vinuni.edu.vn/) is the first private, not-for-profit Vietnamese university established based on international...

3 days ago
PhD-student: Mechanical Metamaterials for Positioning
Upon loading and unloading wafers in nanolithography machines, friction occurs between the wafer and its support. While some friction is required to fixate the wafer, inhomogeneous deformations and stresses that occur during these positioning processes can affect the accuracy...

4 days ago
| Søknadsfrist: jun. 15
Call for Dioscuri Centres of Scientific Excellence in Poland
Max-Planck-Gesellschaft (MPG) and National Science Centre Poland (NCN) open the fourth call for Dioscuri Centres of Scientific Excellence in Poland.
The joint call by MPG and NCN is designed to establish up to three Centres of Scientific Excellence at Polish Host...

4 days ago
PhD-student: Mechanical Metamaterials for Positioning
Upon loading and unloading wafers in nanolithography machines, friction occurs between the wafer and its support. While some friction is required to fixate the wafer, inhomogeneous deformations and stresses that occur during these positioning processes can affect the accuracy...

5 days ago
R&D Engineer Grinding
Supporting R&D activities on Wafer Grinding and CMP
Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation...

5 days ago
R&D Engineer Layer Transfer
You will be responsible for developing new layer transfer processes and you are participating in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices).
What you will do
Miniaturization of system...