Din jobbvarsel har blitt opprettet.

118 Stillinger innen Materialteknikk

Finn ledige stillinger innen Materialteknikk. Registrere deg for våre jobbvarsler for at motta Materialteknikk-stillinger den dagen de bliver lagt ut.

SØKERESULTATER (118 STILLING)
2 days ago
Vin University
Vin University
Plassering Hanoi, Vietnam
Vice Provost, Academic Affairs
Vice Provost Office Location Vietnam Open Date Feb 5, 2021 Description ABOUT VINUNIVERSITY VinUniversity (VinUni: https://vinuni.edu.vn/) is the first private, not-for-profit Vietnamese university established based on international standards. The university...
2 days ago
Vin University
Vin University
Plassering Hanoi, Vietnam
Vice Provost, Research & Innovation
Vice Provost Office Location Vietnam Open Date Feb 5, 2021 Description ABOUT VINUNIVERSITY VinUniversity (VinUni: https://vinuni.edu.vn/) is the first private, not-for-profit Vietnamese university established based on international standards. The university...
2 days ago
Vin University
Vin University
Plassering Hanoi, Vietnam
Dean of Engineering & Computer Science
College of Engineering and Computer Science Location Vietnam Open Date Feb 5, 2021 Description ABOUT VINUNIVERSITY VinUniversity (VinUni: https://vinuni.edu.vn/) is the first private, not-for-profit Vietnamese university established based on international...
3 days ago
Advanced Research Center for Nanolithography ARCNL
Advanced Research Center for Nanolithography ARCNL
Plassering Amsterdam, Nederland
PhD-student: Mechanical Metamaterials for Positioning
Upon loading and unloading wafers in nanolithography machines, friction occurs between the wafer and its support. While some friction is required to fixate the wafer, inhomogeneous deformations and stresses that occur during these positioning processes can affect the accuracy...
4 days ago | Søknadsfrist: okt. 31
CEA Tech
CEA Tech
Plassering Grenoble, Frankrike | Søknadsfrist: okt. 31
PhD position - novel integrated circuit topologies using innovative capacitive components on silicon
SL-DRT-21-0814 RESEARCH FIELD Emerging materials and processes for nanotechnologies and microelectronics ABSTRACT The objective of this thesis is to assess the potentiel of hybrid silicon capacitors developed at LETI as components in novel architectures of...
4 days ago | Søknadsfrist: jun. 15
Call for Dioscuri Centres of Scientific Excellence in Poland
Max-Planck-Gesellschaft (MPG) and National Science Centre Poland (NCN) open the fourth call for Dioscuri Centres of Scientific Excellence in Poland. The joint call by MPG and NCN is designed to establish up to three Centres of Scientific Excellence at Polish Host...
4 days ago
AMOLF
AMOLF
Plassering Amsterdam, Nederland
PhD-student: Mechanical Metamaterials for Positioning
Upon loading and unloading wafers in nanolithography machines, friction occurs between the wafer and its support. While some friction is required to fixate the wafer, inhomogeneous deformations and stresses that occur during these positioning processes can affect the accuracy...
4 days ago | Søknadsfrist: apr. 15
Université catholique de Louvain
Université catholique de Louvain
Plassering Louvain-La-Neuve, Belgia | Søknadsfrist: apr. 15
Postdoctoral position – Fabrication of a patch for diabetes treatment by 3D bioprinting
A postdoctoral position in ‘Development of a patch by 3D bioprinting for diabetes treatment’ starting in April 2021 (negotiable) is open in the Institute of Condensed Matter and Nanosciences in close collaboration with the Laboratory of Experimental Surgery (Prof. Pierre...
5 days ago
imec
imec
Plassering Heverlee, Belgia
R&D Engineer Grinding
Supporting R&D activities on Wafer Grinding and CMP Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation...
5 days ago
imec
imec
Plassering Heverlee, Belgia
R&D Engineer Layer Transfer
You will be responsible for developing new layer transfer processes and you are participating in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices). What you will do Miniaturization of system...